Showing results: 46 - 59 of 59 items found.
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CELERA One Series -
Alkeria Srl
CELERA One camera series provide the same excellence in quality, flexibility and performances of CELERA cameras, with the only exception of a single USB3 interface, while keeping the original extremely reduced dimensions and rugged design that make CELERA One cameras suitable for most applications: automated optical inspection, high performance sorting systems, industrial metrology, microscopy, medical diagnostics and machine vision.
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Intego GmbH
Due to their special material properties, ceramic and glass components are the basis of many high-tech products. The same properties make the production complex and costly. Substrate defects that lead to failure of finished components should be avoided at all costs. For this reason, early automated optical inspection is essential.For the inspection of sapphire and quartz glass Intego has developed systems to detect both external and internal defects and can also provide cutting suggestions. Using index matching it is possible to test rough or uneven glass profiles.For the inspection of ceramic components Intego offers solutions specifically tailored to the respective testing task. Our modular design uses standard components that have already been developed and tested and in most cases only requires minimal adaptation.
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Sherlock-300B -
Manncorp
Compact Sherlock 300B batch PCB inspection (AOI) system provides manufacturers with the benefits of inline AOI—hands-off board handling, automatic good/bad board sorting and minimal operator interaction—in the convenience and flexibility of a standalone AOI station that can be located anywhere in the facility and used to process boards from multiple production lines, including production lines that aren't inline/automated, such as smaller and benchtop lines. With an average cycle time of 10 seconds per board (including transport), Sherlock 300B automated optical inspection (AOI) machine can be used for everything from first article to 100% inspection for increased quality and production yields. (Cycle time measured using a 7.3" x 5.1" (185 x 130 mm) PCB with 253 parts.)
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GOM GmbH
In the standardized measuring machine ATOS ScanBox, ATOS Triple Scan is used for fully automated measuring and inspection of parts. The ATOS ScanBox is a complete optical 3D measuring machine that was developed by GOM for an efficient quality control in production and manufacturing processes. In the ATOS ScanBox models of series 5, 6, 7 and 8, ATOS Triple Scan can be extended with a Plus Box photogrammetry add-on. This allows bigger components or multiple parts to be measured simultaneously.
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ATOS Core -
GOM GmbH
ATOS Core is the specialist for the three-dimensional measurement of small components up to 500 millimeters in size. The sensor forms the basis for a diverse range of measuring tasks – from simple 3D scanning to fully automated measurement and inspection processes. The ATOS Core is used for the three-dimensional measurement of small and medium-sized objects such as ceramic cores, and cast or plastic parts. To capture also large objects of several meters in optimal workflows, the ATOS Core can be easily combined with digital photogrammetry of GOM's optical 3D coordinate measuring machine TRITOP.
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CELERA -
Alkeria Srl
CELERA CMOS Dual USB3 cameras provides unrivaled speed, extreme flexibility and quick system integration. Its double USB3 interface, ultra-fast acquisition rate, extremely reduced dimensions and rugged design make CELERA cameras suitable far the most demanding applications: automated optical inspection, high performance sorting systems, industrial metrology, microscopy, medical diagnostics and machine vision. CELERA cameras are powered directly by the USB3 bus eliminating the need for external power adapters. USB3 provides the most cost effective and widespread interface, pushing speed performances at the top.
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Spinnaker Contract Manufacturing, Inc.
As standard practice, all of our SMT assemblies are washed and tested through our Automated Optical Inspection and pass through our stringent internal QA/QC policies. In Cables and Wire Harnesses, pretests, such as pull tests and crimp type tests, are performed on all builds before being tested for continuity, hi-pot, shorts and mis-wires, to name a few. Our electromechanical assemblies are capable of receiving full functional testing through custom test fixtures and RF test. Some RF tests include Gain/Loss, Frequency Response, VSWR (Voltage Standing Wave Ratio), Inter-Modulation Distortion and Output Power.
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HDM Series -
Park Systems Corp.
The task of identifying nanoscale defects is a very time consuming process for engineers working with media and flat substrates. Park NX-HDM is an atomic force microscopy system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. Park NX-HDM links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput. In addition, Park NX-HDM provides accurate sub-angstrom surface roughness measurements, scan after scan. Park NX-HDM, together with its industry's lowest noise floor, and its unique True Non-Contact™ technology, it is the most accurate AFM for surface roughness measurement in the market.
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AX92320 -
Axiomtek Co., Ltd.
The AX92320 supports PCI Express x4 lane, two or four independent Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports and GigE Vision camera compliance. The PCI Express x4 frame grabber can provide up to 30 watts at 54 VDC power to port which allows power to be supplied to connected PoE-based devices, such as GigE Vision cameras in machine vision systems. The intelligent GigE Vision card also supports IEEE 1588 (precise time protocol), enabling synchronization with multi-camera acquisition. Combining IEEE 1588 and PoE function, the card utilizes a single Ethernet cable for power, data, and synchronization. Furthermore, it supports jumbo frames up to 9.5KB. The AX92320 is ideal for PoE applications such as automated optical inspection (AOI), factory automation, and PC-based surveillance systems.
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Teledyne Defense Electronics
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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ficonTEC Service GmbH
Our machines employ industry-proven production technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and automated optical inspection. ficonTEC also provides a suite of test capabilities for individual components and hybrid opto-electronic devices, both on and off-wafer. Moreover, with everything being orchestrated by our flexible PROCESS CONTROL MASTER software, the machine platforms and product lines described below become so much more than just the sum of their parts. The technologies and capabilities implemented in all machine platforms translate into a broad and established spectrum of production process expertise. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet and exceed efficiency and yield requirements even for cutting-edge production processes. For the team here at ficonTEC, we face your challenges every day.
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CEM881 -
Axiomtek Co., Ltd.
The CEM881 COM Express Type 6 compact form factor module is powered by the latest 14nm 5th generation Intel® Core™ i7/i5/i3 or Celeron® processor with low 15 Watt TDP. The advanced computer-on-modules CEM881 provides advanced processing and high graphics performance combined with cool and efficient operation. With one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB, the extremely small SoC module boosts its fabulous computing performance, industrial grade wide temperature, and seismic design. The rugged and powerful CEM881 is an ideal solution for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, transportation, Internet of Things-related, automated optical inspection (AOI), digital signage, gaming machines, military, and networking.
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BVM-5006 -
BYC Industrial Ltd
BVM-5006 Electric 3D Microscope features the quality optical system, high resolution, large field of view, high zoom ratio, novel design and one-up technology, easy and automatic operations. Includes: Motorized zooming, motorized observation angle for changing and optional motorized focusing. The speed can be adjusted while changing observation angle. With the angle attachment, the microscope can realize 3D image effects for observing the components and deep holes. The LED lights can generate high brightness. Theoretically the service life of LED lights can reach 20,000 hours. The LED lights with area control function can illuminate from different angles for convenient multi-angle inspections. The M-N3D Microscope can be widely used in micro-electronics, automated monitoring and testing industries. By selecting the appropriate objectives and video couplers, different magnification, field of view and depth of field can be acquired. Digital and Analog video systems can meet the different users' demands.
